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XGZP2604

    XGZP2406 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class-100 clean room. The pressure sensing chip utilizes a piezoresistive Wheatstone bridge in a design that anodically bonds glass to a chemically etched silicon diaphragm.. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear millivolt voltage signal that is proportional to input pressure. 


    Chip size is 2.4×2.4×0.62mm(0.094×0.094×0.024 in) for silicon bonding with glass.It provide a best-in-class operating temperature(-40--180’c)/(-40--356℉)and superior stability. 


    With good repeatability, linearity, stability and sensibility, XGZP2406 is also easy for users to calibrate output, thermal drift etc,. by using operational amplifier or integrated circuit.It’s applicable for fluid filled and isolated from measured media,and other simple packaged sensor.


XGZP2406 Pressure Sensor Die

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■ Ranges: 0~1kPa…1000kPa(0~0.15PSI…30PSI) 

■ Piezoresistive MEMS Technology 

■ Solid state,High reliability 

■ Gauge pressure, Excited by voltage or current. 

■ Cost effective



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■ For Medical and healthy equipment field, such as Blood pressure test and monitor, Patient Monitoring, Infusion and Syringe Pumps, Anesthesia Machines, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology, Massage device etc. 

■ For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Emergency Lamp,Sport Equipment etc. 

■ For Other fields, such as air pump, emergency lamp, dust collector, HVAC and pneumatic device,automotive application etc.

Pressure sensor 

MORE SPECIFICATION, REFER TO DATASHEET

  

XGZP2604 Pressure Sensor Die(V1.3).pdf



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