XGZP2406 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class-100 clean room. The pressure sensing chip utilizes a piezoresistive Wheatstone bridge in a design that anodically bonds glass to a chemically etched silicon diaphragm.. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear millivolt voltage signal that is proportional to input pressure. 

Chip size is 2.4×2.4×0.62mm(0.094×0.094×0.024 in) for silicon bonding with glass.It provide a best-in-class operating temperature(-40--180’c)/(-40--356℉)and superior stability. 

With good repeatability, linearity, stability and sensibility, XGZP2406 is also easy for users to calibrate output, thermal drift etc,. by using operational amplifier or integrated circuit.It’s applicable for fluid filled and isolated from measured media,and other simple packaged sensor.