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    XGZP1804 series pressure sensor chip is a miniature silicon piezoresistive sensor die that is designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm.  When the springy diaphragm is pressured, Wheatstone bridge will output linear millivolt voltage that is proportional to input pressure.


    Chip size is 1.8x1.8×0.4 mm for silicon bonding with silicon, which provide state-of-the-art performance in a leading small size for oil-filling or isolated-diaphragm sensor.


    With good repeatability, linearity, stability and sensibility, XGZP1804 is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.

XGZP1804 Pressure Sensor Die


■ Ranges: 0~40kPa…200kPa(0~5.8PSI…30PSI) 

■ Piezoresistive MEMS Technology 

■ Gauge pressure, Excited by voltage or current. 

■ Solid state,High reliability 

■ Cost effective

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■ TPMS sensor, MAP sensor, oil pressure test, Automotive electronics field etc. 

■ For Home appliance field, such as Air compressors, home appliances, and other civilian fields 

■ For water pressure test field, such as water pump, fire, diving, dam etc. 

■ Oxygen equipment, electronic blood pressure monitor, massager Medical electronics field.

■ Meteorology, air pressure switches, children's toys, sports and fitness, etc

Pressure sensor  



XGZP1804 Sensor Chip.pdf

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