XGZP183 is a piezoresistive pressure sensor with gel filling inside. The core is a silicon piezoresistive pressure sensing die that is designed and fabricated by MEMS technology. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors build up a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure. It is easy for users to install by surface mounting or welding with this standard SOP8 package.

       With good repeatability, linearity, stability and sensibility, XGZP183 is very facile for users to calibrate output, thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit. 

      For amplified output version or IIC interface, please refer to XGZP6869A or XGZP6869D.