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XGZP183

         XGZP183 is a piezoresistive pressure sensor with gel filling inside. The core is a silicon piezoresistive pressure sensing die that is designed and fabricated by MEMS technology. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors build up a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure. It is easy for users to install by surface mounting or welding with this standard SOP8 package.

           With good repeatability, linearity, stability and sensibility, XGZP183 is very facile for users to calibrate output, thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit. 

          For amplified output version or IIC interface, please refer to XGZP6869A or XGZP6869D.

XGZP183 Pressure Sensor

images11.jpgRanges:  -100kPa…-1kPa~0kPa…1kPa...200kPa

Power supply: ≤15Vdc or ≤3.0mAdc   

Gage & Vacuum Type

SMD package with gel filling.

MEMS Technology, Solid-state reliability

Working temp.: -30+125℃(-22+257)

For Non-corrosive gas or air or liquid


images (11).jpgFor Medical and healthy equipment field, such as Blood pressure test and monitor, Patient Monitoring, Infusion and Syringe Pumps, Anesthesia Machines, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology, Massage device etc.
For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Sport Equipment etc.
For Other fields, such as air pump, emergency lamp, dust collector, HVAC and pneumatic device, IoT, automotive application etc.

Pressure Sensor    

MORE SPECIFICATION, REFER TO DATASHEET

 

XGZP183 Pressure Sensor-V2.2.pdf




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