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XGZP153

           XGZP153 pressure sensor base on CFSensor silicon based piezoresistive pressure sensor die. The sensor die is bonded on a substrate with a metal cap and packaged in a PC Board. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure.


            With good repeatability, linearity, stability and sensibility, XGZP153 is also easy for users to calibrate output by using operational amplifier or integrated circuit.


           The XGZP153 pressure sensor is intended for use with non-corrosive gas or air. It is highly prohibited to choke the side of pressure diaphragm during actual application.


           For IIC interface version, check XGZP6819D.or XGZP6829D

XGZP153 Pressure Sensor

images11.jpgRanges:  -100kPa…-1kPa~0kPa…1kPa...200kPa

Power supply: ≤15Vdc or ≤3.0mAdc   

Gage & Vacuum Type

COB package

MEMS Technology, Solid-state reliability

Working temp.: -30+125℃(-22+257)

For Non-corrosive gas or air 


images (11).jpgFor Medical and healthy equipment field, such as Blood pressure test and monitor, Patient Monitoring, Infusion and Syringe Pumps, Anesthesia Machines, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology, Massage device etc.
For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Sport Equipment etc.
For Other fields, such as air pump, emergency lamp, dust collector, HVAC and pneumatic device, IoT, automotive application etc.

Pressure Sensor    

MORE SPECIFICATION, REFER TO DATASHEET

 

XGZP153 Pressure Sensor-V2.2.pdf



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