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    XGZP182 is a piezoresistive pressure sensor with gel filling inside. The core is a silicon piezoresistive pressure sensing die that is designed and fabricated by MEMS technology. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors build up a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure.

    With standard SOP8 package, It is easy for users to install by surface mounting or welding.With good repeatability, linearity, stability and sensibility, XGZP182 is very facile for users to calibrate output, thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit.

           For amplified output or IIC interface, check XGZP6858A or XGZP6858D.

XGZP182 Pressure Sensor

images11.jpgRanges: 0kPa~100kPa…200kPa(0PSI~15PSI…30PSI)

≤15Vdc or ≤3.0mAdcpower supply  
Absolute Pressure Type
For Non-corrosive gas or air and liquid
MEMS Technology, SMD package

Working temp.: -30+125(-22+257)

images (11).jpgSmall household appliances field, such as electric cooker, milk machine, purifier,coffee machine etc, medical instruments and device.

Automotive electronics field, such as tire pressure gauge,MAP sensor etc.

Other fields, such as massage appliance, air spring and air bed, animals blooding pressure equipment, gastrointestinal medical device etc.

Pressure Sensor      



XGZP182 Pressure Sensor-V2.2.pdf

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