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    XGZP170 is a piezoresistive pressure sensor that was designed for extremely space sensitive application where the sensing element is to be integral to the OEM products. The core is a silicon piezoresistive pressure sensing die that is designed and fabricated by MEMS technology. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure.

    With standard SOP8 package, It is easy for users to install by surface mounting or welding.

    With good repeatability, linearity, stability and sensibility, XGZP170 is very facile for users to calibrate output, thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit and applied in sorts of Absolute pressure measurement application.

XGZP170 Pressure Sensor

images11.jpgRanges:  0kPa~100kPa…1500kPa

Power supply: ≤15Vdc or ≤3.0mAdc   

Absolute Pressure Type

SMD package with gel filling

MEMS Technology, Solid-state reliability

Working temp.: -30+125℃(-22+257)

For Non-corrosive gas or air or liquid 

images (11).jpgAltimeter; Air Pump; Fire extinguisher.

Automotive electronics field, such as tire pressure gauge, MAP sensor etc.

Pressure meter, meteorology and consumer electronic etc.

Other absolute pressure or vacuum systems

Pressure Sensor    



XGZP170 Pressure Sensor-V2.2.pdf

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