Your current location:Home > Sensors > Pressure Sensor (mV) > XGZP168


        XGZP168 is a surface mounting pressure sensor based on CFSensor silicon based piezoresistive pressure sensor die. The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pin SOP or DIP. The small size and high reliability of on-chip integration make this sensor a simple and economical choice for high volume application in a variety of industries. With standard SOP6 or DIP6 package, XGZP168 is easy for users to install by SMT or through hole board assembly. 

        With good repeatability, linearity, stability and sensibility, XGZP168 is very facile for users to calibrate output & thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit.(For amplified and calibrated sensor if required,please refer to CFSensor pressure module series)

        The XGZP168 pressure sensor is intended for use with non-corrosive gas or air. It is highly prohibited to choke the side of pressure diaphragm during actual application. Please consult us if a pressure medium other then air is to be used.

XGZP168 Pressure Sensor

images11.jpgRanges:  -100kPa~0kPa…1kPa...1000kPa

Power supply: ≤15Vdc or ≤3.0mAdc   

Gage & Vacuum Type

SMD or Through hole package

MEMS Technology, Solid-state reliability

Working temp.: -30+125℃(-22+257)

For Non-corrosive gas or air 

images (11).jpgFor Medical and healthy equipment field, such as  Patient Monitoring, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology etc.
For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Sport Equipment etc.
For Other fields, such as air pump, instrument and meter, HVAC and pneumatic device, IoT, automotive application etc.

Pressure Sensor    



XGZP168 Pressure Sensor-V2.3.pdf

Scan wechat
WhatsApp Skype QQ 15161516705