XGZP1006 series pressure sensor chip is a miniature silicon piezoresistive sensor die that is designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge will output linear millivolt voltage that is proportional to input pressure. 

Chip size is 0.9×0.9×0.6 mm for silicon bonding with silicon, which provide state-of-the-art performance in a leading small size for oil-filling or isolated-diaphragm sensor. 

With good repeatability, linearity, stability and sensibility, XGZP1006 is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.