XGZP2004 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear millivolt voltage that is proportional to input pressure. 

Chip size is 2.0×2.0×0.4 mm(0.08×0.08×0.015 in) for silicon bonding without glass, or 2.0×2.0×0.9 mm(0.08×0.08×0.035 in) with glass.(Unless otherwise specified, the chip with pressure ≤200kPa come without glass) 

With good repeatability, linearity, stability and sensibility, XGZP2004 is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.